Riviere J.C. (ed.), Myhra S. (ed.) — Handbook of Surface and Interface Analysis :: Электронная библиотека попечительского совета мехмата МГУ

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Riviere J.C. (ed.), Myhra S. (ed.) — Handbook of Surface and Interface Analysis

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Название: Handbook of Surface and Interface Analysis

Авторы: Riviere J.C. (ed.), Myhra S. (ed.)

Аннотация:

Integrating advances in instrumentation and methods, this work offers an approach to solving problems in surface and interface analysis, beginning with a particular problem and then explaining the most rational and efficient route to a solution. The book discusses electron optical and scanned probe microscopy, high spatial resolution imaging and synchrotron-based techniques. It emphasizes problem-solving for different classes of materials and material function.

Язык:

Рубрика: Физика/

Статус предметного указателя: Готов указатель с номерами страниц

ed2k: ed2k stats

Издание: 1st edition

Год издания: 1998

Количество страниц: 968

Добавлена в каталог: 16.11.2009

Операции: Положить на полку | Скопировать ссылку для форума | Скопировать ID

Предметный указатель

Ceramics, surface structures, fracture and abrasion effects      578
Ceramics, surface structures, information from AFM      579
Ceria, catalyst      169
Ceria, electronic configuration      169
Ceria, shake-up features      169—170
Cermets, thin films      327—332
Cermets, thin films, composition      328
Cermets, thin films, ion bombardment effects      327—332
Cermets, thin films, preparation      327
Cermets, thin films, properties and applications      327
Charging, surface      70 98—99 172 202 313 492—493 516 571 589 616 751 758
Charging, surface, differential      70 492 516 616—618 757 805
Charging, surface, differential, elimination      617
Charging, surface, in depth profiling      270 313—314 589
Charging, surface, in depth profiling, minimisation      314
Charging, surface, in ISS      130 751
Charging, surface, in SAM      118 516 551
Charging, surface, in SIMS      751
Charging, surface, minimisation methods      98 215—216 270 314 571 651 751 757
Charging, surface, monochromatisation      757
Charging, surface, problem avoidance by use of Auger parameter      181 331 492 760 799—800
Chemical shifts, AES, Al      179
Chemical shifts, AES, As      509
Chemical shifts, AES, C      180 277
Chemical shifts, AES, Ga      509
Chemical shifts, AES, Mg      179
Chemical shifts, AES, P      509
Chemical shifts, XPS, theory      170—171 615 757
Chemical state, C 1s      61 78 172
Chemical state, Pb in Roman lead pipe      856—857
Chemical state, plot of $\alpha^{*}$ , Cu      766
Chemical state, plot of $\alpha^{*}$ , Na      182
Chemical state, Sn in Roman lead pipe      856—857
Chemical vapour deposition (CVD)      298—299 737
Collision cascade      210 227 240 350
Composites, depth profiling      618—619
Composites, depth profiling, ion bombardment damage      610 618
Composites, depth profiling, non-destructive      618—619
Composites, depth profiling, sample mounting      608 619
Composites, electrochemical oxidation, C 1s spectra      611 620—622 628 632
Composites, epoxy resin, C 1s spectrum      628—629
Composites, fibre reinforcement      605 804
Composites, fibres, electron beam damage      609
Composites, fibres, mounting arrangement      606 608
Composites, fibres, problems with conducting fibres in instrumentation      607
Composites, fibres, sputtering damage      609—610
Composites, fibres, X-irradiation damage      609 619—620
Composites, interfaces      606 636 638 804
Composites, interfaces, method of examination      636 638—639
Composites, interfaces, spectrum subtraction method      639
Composites, internal surfaces, fracture      609—610 804
Composites, introduction      605—606
Composites, matrix material      605 787
Composites, oxidation problems      606
Composites, surface analytical techniques      610—614
Composites, surface analytical techniques, AFM      612—613
Composites, surface analytical techniques, FTIR and Raman spectroscopies      611—612
Composites, surface analytical techniques, ISS      614
Composites, surface analytical techniques, SEM      612
Composites, surface analytical techniques, SIMS      614
Composites, surface analytical techniques, surface free energy      613
Composites, surface analytical techniques, TPD      614
Composites, surface analytical techniques, WDS      612
Composites, surface analytical techniques, XPS      614—639
Composites, surface analytical techniques, XRD (grazing incidence)      610—611
Composites, surface functionality      619—621
Composites, surface functionality, advantages of X-ray monochromatisation      621
Composites, surface functionality, curve-fitting of C Is and O Is spectra      611 620 622 625—628
Composites, surface functionality, decomposition by heat from X-ray source      619—621
Composites, surface functionality, from valence band features      620 632—636
Composites, valence band emission, C — O bond lengths      634
Composites, valence band emission, chemical information      632—637
Concentric hemispherical analyzer, CHA      67
Concentric hemispherical analyzer, CHA, $\acute{e}$ tendue      69
Concentric hemispherical analyzer, CHA, characteristics      68—69
Concentric hemispherical analyzer, CHA, energy resolution      68 165
Concentric hemispherical analyzer, CHA, lens system for imaging      90—91
Concentric hemispherical analyzer, CHA, retardation      68
Concentric hemispherical analyzer, CHA, slit width      68
Concentric hemispherical analyzer, CHA, use in AES      98
Configuration of elements, table      873—876
Conversion electron M $\ddot{o}$ ssbauer spectroscopy (CEMS)      360—368
Conversion electron M $\ddot{o}$ ssbauer spectroscopy (CEMS), characteristics      43
Conversion electron M $\ddot{o}$ ssbauer spectroscopy (CEMS), tribology      707 717—718
Conversion factors, energy      872
Conversion factors, pressure      872
Corrosion, AES analysis      661—665
Corrosion, AES analysis, advantages and disadvantages      661—662 679
Corrosion, AES analysis, corrosion products on S/S      304 663
Corrosion, AES analysis, depth profiling      664—665 670
Corrosion, AES analysis, interface location and broadening      664—665
Corrosion, AES analysis, mapping      664
Corrosion, AES analysis, procedure      662
Corrosion, AES analysis, with SEM      661—663
Corrosion, analysis strategy      650
Corrosion, choice of analytical techniques      650—651
Corrosion, contaminants      647 653 783
Corrosion, contaminants, from autoclaves      647
Corrosion, contaminants, problems and removal      653
Corrosion, cross-section preparation      650—653
Corrosion, cross-section preparation, cryogenic fracture      651—652
Corrosion, cross-section preparation, film thickness      652—653
Corrosion, cross-section preparation, impregnation of porosity      651
Corrosion, cross-section preparation, mounting procedures      651
Corrosion, cross-section preparation, polishing procedures      651
Corrosion, EDS analysis, cross-section of epoxy on steel      654 656 658
Corrosion, EDS analysis, light elements      654
Corrosion, EDS analysis, oxide film      654 657
Corrosion, electrochemistry and electrochemical processes      644 668 671—674 791
Corrosion, improvement by ion implantation      368
Corrosion, introduction      643—644
Corrosion, IR spectroscopy      667
Corrosion, Monel 400, AFM      682—686
Corrosion, Monel 400, background      668—669
Corrosion, Monel 400, composition      668—669
Corrosion, Monel 400, Cu and Ni 2p XPS spectra      690
Corrosion, Monel 400, electrochemical measurements      682 690—692
Corrosion, Monel 400, experimental strategy      669—671
Corrosion, Monel 400, film thickness      677 683
Corrosion, Monel 400, grain boundary segregation      668—670 692—693
Corrosion, Monel 400, metallographic analysis      675—677
Corrosion, Monel 400, SEM images      676 687
Corrosion, Monel 400, SIMS images      670 678
Corrosion, Monel 400, SIMS profiles      678 691
Corrosion, Monel 400, specimen preparation      669—671
Corrosion, Monel 400, XPS analysis      684 688—689
Corrosion, optical microscopy, choice of analysis regions      648—650
Corrosion, optical microscopy, description      648—650
Corrosion, optical microscopy, initial examination      648—650
Corrosion, optical microscopy, stereo      648
Corrosion, Raman spectroscopy      667
Corrosion, sample handling      646—648
Corrosion, sample handling, critical point drying      647
Corrosion, sample handling, cutting methods      647
Corrosion, sample handling, fixing of biologically corroded samples      647
Corrosion, sample handling, precautions      646—647
Corrosion, sample handling, storage requirements      646—647
Corrosion, SEM analysis, optimum operating conditions      654 656
Corrosion, SEM analysis, pitted corrosion surface      654 656
Corrosion, SIMS analysis      665—667
Corrosion, SIMS analysis, advantages      666
Corrosion, SIMS analysis, choice of primary ion      666
Corrosion, SIMS analysis, depth profiling      666—667 677—678
Corrosion, SIMS analysis, detection of H      666
Corrosion, SIMS analysis, mapping      666 670 678
Corrosion, SIMS analysis, trace element sensitivity      666 668—669
Corrosion, SPM      667 682—686
Corrosion, steel, adhesive joints      791—799
Corrosion, steel, conversion coatings      794—795
Corrosion, steel, interfacial chemistry      792 794

Corrosion, steel, XPS analysis      793
Corrosion, types of corrosion      644—645
Corrosion, XPS analysis, BEs      660
Corrosion, XPS analysis, chemical states      660 690
Corrosion, XPS analysis, crevice in Alloy      600 659
Corrosion, XPS analysis, depth profiling      659—661 679
Corrosion, XPS analysis, quantification procedure      659—661 684 688—689
Corrosion, XPS analysis, recommended conditions      658—659
Corrosion, XPS analysis, small area      656 660
Corrosion, XPS analysis, water of hydration      661
Corrosion, XRD (grazing incidence)      667
Cracks, in metals      477—481
Cracks, in metals, age determination      478
Cracks, in metals, depth profiling      480—481
Cracks, in metals, opening in UHV      481
Cracks, in metals, optical examination      478
Cracks, in metals, oxide thickness      478
Cracks, in metals, SAM O image      479
Cracks, in metals, SEM image      479
Crater depth, profiling      269
Cross-sections, ionization      195—196 333
Cross-sections, photoemission      189—191 659 684 750
Crystal structure, thin films techniques      300—301
Curve-fitting, XPS      79 165 277 316—317 624—632
Curve-fitting, XPS, $\chi^{2}$ sum      176 277
Curve-fitting, XPS, asymmetric peaks      625
Curve-fitting, XPS, background subtraction      625—629
Curve-fitting, XPS, background subtraction, energy range      626
Curve-fitting, XPS, background subtraction, linear      626 630
Curve-fitting, XPS, background subtraction, non-linear iterative      626 630 632
Curve-fitting, XPS, background subtraction, Tougaard      626 630
Curve-fitting, XPS, C 1s      174 618 620—624 627—629 631
Curve-fitting, XPS, C 1s, $\beta$ -carbon atoms      174 629—631
Curve-fitting, XPS, C 1s, bridged structures      625 634
Curve-fitting, XPS, C 1s, changes with oxidation      611 623
Curve-fitting, XPS, C 1s, functional contributions      611 623—625
Curve-fitting, XPS, C 1s, graphitic character      622—623 625 627
Curve-fitting, XPS, C 1s, Lorentzian line shape      625 627
Curve-fitting, XPS, C 1s, model compounds      624
Curve-fitting, XPS, component peaks      611 618 620—621 623—624 626-631
Curve-fitting, XPS, difference spectra      277
Curve-fitting, XPS, exponential tail      625 629—630
Curve-fitting, XPS, factor analysis      277—278
Curve-fitting, XPS, Fe 2p      566—567
Curve-fitting, XPS, fit probability      177
Curve-fitting, XPS, fixed doublet ratio      175
Curve-fitting, XPS, Gausso — Lorentzian line shape      150 165 168 175 622—623 625—628
Curve-fitting, XPS, Gausso — Lorentzian line shape, FWHM      175
Curve-fitting, XPS, iterative minimisation      176
Curve-fitting, XPS, least-squares      277
Curve-fitting, XPS, maximum entropy      277
Curve-fitting, XPS, monochromatisation      628—632
Curve-fitting, XPS, N 1s      316 321—324 631—632
Curve-fitting, XPS, N 1s, BEs      631—632
Curve-fitting, XPS, N 1s, inclusion of loss peaks      316
Curve-fitting, XPS, O 1s      611 618 621—622 630—631
Curve-fitting, XPS, S 2p      566—567
Curve-fitting, XPS, self-consistency      622 625—627
Curve-fitting, XPS, sequential treatments      626—628
Curve-fitting, XPS, Si 2p      330—331
Curve-fitting, XPS, Ti 2p      316—317 319
Curve-fitting, XPS, valence band      632—637
Curve-fitting, XPS, X-ray satellites      625
Cylindrical mirror analyser, CMA      97
Cylindrical mirror analyser, CMA, characteristics      66—68 95—98
Cylindrical mirror analyser, CMA, energy resolution      66 68
Cylindrical mirror analyser, CMA, sample position      68 98 165
Cylindrical mirror analyser, CMA, transmission      68 98
Cylindrical mirror analyser, CMA, use in AES      68 95 98
Cylindrical mirror analyser, CMA, use in XPS (DPCMA)      66—68
Damage, electron beam      95 271 325 490—491 508 511 609 750 752—753
Damage, electron beam, catalysts      750 752
Damage, electron beam, contamination build-up      491
Damage, electron beam, SAM      95 118—119 508 894
Damage, electron beam, Si suboxides      511
Damage, ion beam      106 300—301
Damage, ion beam, calculation      106
Damage, ion beam, chemical state changes      107
Damage, ion beam, compositional changes      107
Damage, ion beam, dependence on operational factors      106—107
Damage, photon beam      163 333—334 488 609 619—621 752-753
Damage, photon beam, catalysts      752—753
Damage, photon beam, oxides      491
Damage, photon beam, SRPS      491
Definitions, miscellaneous      33
Densities of elements      873—876
Densities of local electronic states (LDOS), determination from Auger CVV spectra      102
Densities of local electronic states (LDOS), determination from STS      405—406
Depth distribution, elemental      75
Depth profiles, AES, Au/Al/ $SiO_{2}$ /Si      275
Depth profiles, AES, electrodeposited Cr film      111
Depth profiles, AES, Fe/O ratio      481
Depth profiles, AES, Ge/Si double layer      306
Depth profiles, AES, Nb/(Pb — In) junction      495
Depth profiles, AES, Nb/Pb junction      495
Depth profiles, AES, oxidised Ni/Cr      665
Depth profiles, AES, Roman lead pipe      845
Depth profiles, AES, Si/Ge multilayers      304—305
Depth profiles, AES, W — N system      277
Depth profiles, DSIMS, computer manipulation      666—667 677—678
Depth profiles, DSIMS, GaAlAs      276
Depth profiles, DSIMS, Monel 400      678
Depth profiles, DSIMS, oxidized alloys 600 and 800      666—667
Depth profiles, GDOES, Zn-coated steel      281
Depth profiles, XPS, $SiO_{2}$ on Si      514
Depth profiles, XPS, Nb/(Pb-ln) junction      497
Depth profiles, XPS, Nb/Pb junction      497
Depth profiles, XPS, Roman lead pipe      846 849—850
Depth profiles, XPS, Roman leaded bronzes      860—861
Depth profiling, AES      106—107 201 257 266—271 301 308 358 480-481
Depth profiling, analytical questions      255
Depth profiling, angular dependence      203—205 263—266 511 619
Depth profiling, background shape, XPS      202—203
Depth profiling, ball-cratering, AES      810
Depth profiling, catalysis      771—772
Depth profiling, catalysis, limited applicability      771
Depth profiling, catalysis, risk of misinterpretation      772
Depth profiling, corrosion      662
Depth profiling, corrosion, damage effects      679
Depth profiling, corrosion, topographical effects      662
Depth profiling, desirable parameters      109 272—273 284—285 303
Depth profiling, destructive, atomic mixing      271 300—301
Depth profiling, destructive, chemical erosion      266
Depth profiling, destructive, compound reduction      496—499 659—660 772 808
Depth profiling, destructive, crater depth      269
Depth profiling, destructive, depth resolution      269—273 300 304 306—307
Depth profiling, destructive, equipment      268 301—304
Depth profiling, destructive, factor analysis      277—278
Depth profiling, destructive, general equation      267—268
Depth profiling, destructive, induced microtopography      271 301 664
Depth profiling, destructive, interface roughening      306—308
Depth profiling, destructive, interpretation      310—313 665—666
Depth profiling, destructive, ion guns      267 303—304
Depth profiling, destructive, mechanical erosion      266
Depth profiling, destructive, optimum conditions      271—273 284—285 303
Depth profiling, destructive, preferential sputtering      268 271 310 496
Depth profiling, destructive, preferential sputtering correction      268
Depth profiling, destructive, sample rotation      272—275 284 302—303
Depth profiling, destructive, surface roughening      306—308 664
Depth profiling, destructive, time/depth conversion      269 311
Depth profiling, destructive, transient composition      269
Depth profiling, DSIMS      212 260 273 282—284 300 666—667
Depth profiling, influence of current density      112
Depth profiling, ISS      151 772
Depth profiling, KE vs. AL method      203 487 501 618—619
Depth profiling, multilayer structures      301—302 304—306
Depth profiling, non-destructive, advantages and disadvantages      266
Depth profiling, non-destructive, angle/depth relation      263—266
Depth profiling, non-destructive, ARAES      104 111—113 263—266 487
Depth profiling, non-destructive, ARXPS      77 260 263—266 487 513 619 794

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