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| Авторизация |
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| Поиск по указателям |
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| Swanson D.G., Hoefer W.J.R. — Microwave Circuit Modeling Using Electromagnetic Field Simulation |
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| Предметный указатель |
Vias 16 205 207—215 252 318—319 321
Vias, advanced model 258—262
Vias, connectors 318—322 328 335
Vias, filters 378—381 403
Vias, frame relay 4 255—258
Vias, grounding pads 271—282
Vias, single layer 262—263
Vias, through hole 284
Virtual time domain reflectometry 170
Visualization, evanescent mode behavior 224
Visualization, finite difference time domain 170
Visualization, finite element method 150—151
Visualization, method of moments 116 122
Visualization, software selection 435—436
| Visualization, transmission line matrix 170
Voltage display 114—116
Volume meshing 23 200
VUSTLSn Model 443
Wave-type port 185 188—189 204 304—305
Waveguide filter 377 407
Wavelet 39
Weighting functions 42—44
Wideband absorbing boundary 66 73 156 160 163
Wideband rectangular waveguide validation 160—163
Wiggly coupler 105 347—357
Yee cell 63—64 70
Zeland IE3D software 92 105 300 349—355 358 448
Zero-length de-embedding 178
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