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Lau J. — Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
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Íàçâàíèå: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA AssembliesÀâòîð: Lau J. Àííîòàöèÿ: One-stop, cutting-edge guide to flip chip technologies. Now you can turn to a single, all-encompassing reference for a practical understanding of the fast-developing field that's taking the electronics industry by storm. Low-Cost Flip Chip Technologies, by John H. Lau, brings you up to speed on the economic, design, materials, process,equipment, quality, manufacturing, and reliability issues related to low cost flip chip technologies. This eye-opening overview tells you what you need to know about applying flip chip technologies to direct chip attach(DCA), flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. You'll discover flip chip problem-solving methods, and learn how to choose a cost-effective design and reliable, high-yield manufacturing process for your interconnect systems as you explore...
*IC trends and packaging technology updates *Over 12 different wafer-bumping methods...more than 100 lead-free solder alloys *Sequential build up PCB with microvias and via-in-pad *How to select underfill materials *And much, much more!
ßçûê: Ðóáðèêà: Òåõíîëîãèÿ /Ñòàòóñ ïðåäìåòíîãî óêàçàòåëÿ: Ãîòîâ óêàçàòåëü ñ íîìåðàìè ñòðàíèö ed2k: ed2k stats Ãîä èçäàíèÿ: 2000Êîëè÷åñòâî ñòðàíèö: 602Äîáàâëåíà â êàòàëîã: 28.04.2014Îïåðàöèè: Ïîëîæèòü íà ïîëêó |
Ñêîïèðîâàòü ññûëêó äëÿ ôîðóìà | Ñêîïèðîâàòü ID
Ïðåäìåòíûé óêàçàòåëü
344—347 123 128 130—132 142 341 ACA see "Anisotropic conductive adhesive" Accelerated aging testing 178—179 ACF see"Anisotropic conductive film" Additive PCB processes 127 Air flow 303—304 ALIVH fabrication process 140 143 Alpha particle 89 Alumina 204 Amkor Technology Inc., wsCSP 331—332 Anam Semiconductor Inc., wsCSP 331—332 Anisotropic conductive adhesive (ACA) 13 157 173—180 Anistropic conductive film (ACF) 13 Anistropic conductive film (ACF), definition 157 Anistropic conductive film (ACF), FCOB, PCB design 163—164 Anistropic conductive film (ACF), FCOB, process 157—158 164—172 Anistropic conductive film (ACF), FCOB, wafers 158—163 Anistropic conductive film (ACF), thermal cycling test of FCOB assemblies with 170—172 ANSYS finite element code 267 330 372 Application-specific IC (ASIC) 4—6 12 Area-array solder-bumped flip chip technology 10 11 511—513 ASIC (Application-specific IC) 4—6 12 Attenuation 398 401—402 Au bumps 159—160 B-SAM image 562—563 565 Ball grid array (BGA) 12 95 Ball-limiting metallurgy (BLM) 44 Bardeen, John 1 BCB (benzocyclobutene) 204 339—341 Bell Laboratories 1 Benzocyclobutene (BCB) 204 339—341 BGA (Ball grid array) 12 95 Bipolar transistor 1 Bismaleimide triazine (BT) 186 556 Black oxide (multibond) 128 Blind vias 122 124 BLM (ball-limiting metallurgy) 44 Brattain, Walter 1 BT (bismaleimide triazine) 186 556 Buried Bump Interconnection Technology ( 143 Buried vias 122 124 C-SAM image 403 418 554 559 561—562 563 565 C4 flip chip assembly 382 C4 technology (controlled-collapse chip connection (C4) technology) 184 Cache memory 4—6 CAMALOT 1818 dispensing system 556 Capacitance measurement 505—506 Cascade Microtech microprobe 396 CBGA (ceramic ball grid array) 10 CCD (charge-coupled device) 9 Cellular phones, mass and size trends 10 Center of Microperipherics Research 174 Ceramic ball grid array (CBGA) 10 Ceramic pin grid array (CPGA) 10 CFD (computational fluid dynamic) 306—307 530—531 545 Charge-coupled device (CCD) 9 Charging system 58 Chemical (wet) etching 124 135—136 Chip scale package (CSP) 10 13 95 Chip size effect 277—285 304—306 CIESS (Copper Interconnect Equipment Set Solution) 7 Circuit tape manufacturing 332 CISC (Complex Instruction Set Computing) 5 CMOS (complementary metal-oxide-semiconductor) 2 Coefficient of thermal expansion (CTE) 568 Collection system 61 Complementary metal-oxide-semiconductor (CMOS) 2 Complex Instruction Set Computing (CISC) 5 Computational fluid dynamic (CFD) 306—307 530—531 545 Conductive adhesive bonded flex 223 Conductive adhesives 157 Conductive ink formation of vias 124 136—141 Conformal method 128 Continuous Stream Metal 58—61 64 Controlled impedance 398—401 Controlled-collapse chip connection (C4) technology 184 Convection resistance 309 Cooling power 486—489 493 498—499 Coplanar stripline traces 467—470 Copper conductor pads 6—7 Copper Interconnect Equipment Set Solution (CIESS) 7 CPGA (ceramic pin grid array) Crack growth 447 Crack tip opening displacement (CTOD) 265 435 439 442—446 447—450 Cracking, in sputtered metal on SBL 343 Creep analysis, time and temperature dependent 324 Creep curves 200—201 Creep shear strain 375 Creep strain energy density 326 Crosstalk 397 401—402 CSP (chip scale package) 10 13 95 CTE (coefficient of thermal expansion) 568 CTOD (crack tip opening displacement) 265 435 439 442—446 447—450 Cu bumps 160—161 169 Cu microvia-VIP 364—365 Curing conditions, of liquidlike underfills 227—232 Curing temperature 202 Damping 195 Data acquisition system (DAS) 423 462—463 DBR (distributed Bragg reflector) 356 DCA (direct chip attach) 10 184—186 317 Deflux process 517—518 Demand-mode ink-jet printing system 55—58 61 Die cracking 562—563 Die passivation 333 Die preparation process flow 515 Dielectrics 132—134 Differential scanning calorimeter (DSC) 100—103 116 Direct 403—414 Direct 389 Direct 396—402 Direct 392—396 Direct 390—396 Direct chip attach (DCA) 10 184—186 317 Direct solder bump-forming process 68 Distance to neutral point (DNP) 383 Distributed Bragg reflector (DBR) 356 DMA (dynamic mechanical analysis) 100 104 105—109 DNP (distance to neutral point) 383 Dried PBGAs 423 Drop-on-Demand Metal 55—58 62 Dry-film technologies 134 DSC (differential scanning calorimeter) 100—103 116 DSC thermal scan curve 191—192 226—231 DYCOstrate 233 Dynamic mechanical analysis (DMA) 100 104 105—109 Dynamic random access memory (DRAM) 5 12 347 E3 solder bumps 185 Elastoplastic analysis 370—379 Electrical performance of Rambus modules 392 Electrical performance, Mitsubishi PC-BGA packages 527—528 Electrical performance, NuBGA package 493 494 Electrical resistance strain gauges 421 Electrical resistivity 116 118 Electronics packaging 9—11 467 Electroplating method 47—48 343 Electrostatic deflection system 60 Electrovert Omniflo 556 Environment control system 60 EPA (United States Environmental Protection Agency) 98 Etching techniques 124 135—136 Evaporation method 44-47 Excimer laser 130 Failure analysis of flip chip on low-cost substrates interfacial shear strength 566—571 Failure analysis of flip chip on low-cost substrates with imperfect underfills 554—563 Failure analysis of flip chip on low-cost substrates, benefits 553—554 Failure analysis, wsCSP 338 Failure modes, under shear testing 206—210 Fairchild Semiconductor 1 FC-BGA package 519—529 537—545 FCIP (flip chip in package) 267 FCOB (flip chip on board) with imperfect underfills, chip size effect (near the solder joints) 277—285 FCOB (flip chip on board), advantages 223 FCOB (flip chip on board), assemblies with ACA 173—180 FCOB (flip chip on board), assemblies with ACF, PCB design 163—164 FCOB (flip chip on board), assemblies with ACF, process 157—158 164—172 FCOB (flip chip on board), assemblies with ACF, wafers 158—163 FCOB (flip chip on board), assembly process 253—256 FCOB (flip chip on board), disadvantages 224 FCOB (flip chip on board), flow rate with underfulls 204—206 FCOB (flip chip on board), high-temperature solder bumps 184—186 FCOB (flip chip on board), low-temperature solder bumps 186—189 FCOB (flip chip on board), shear test with underfills 206—210 FCOB (flip chip on board), thermal management see "Liquidlike underfills" FCOB (flip chip on board), thermal management, air flow effects 303—304 FCOB (flip chip on board), thermal management, chip size effects 304—306 FCOB (flip chip on board), thermal management, heat paths 306—308 FCOB (flip chip on board), thermal management, heat sinks 310—312 FCOB (flip chip on board), thermal management, PCB construction 302—303 FCOB (flip chip on board), thermal management, power dissipation area 304—306 FCOB (flip chip on board), thermal management, SGS-Thompson test chip 301—302 FCOB (flip chip on board), thermal management, signal copper content in PCB 308—309 FCOB (flip chip on board), thermal management, solder bump population 308 FCOB (flip chip on board), thermal management, underfill materials 309—310 FCOB (flip chip on board), with imperfect underfills, development history 263—264 FCOB (flip chip on board), with imperfect underfills, effect of voids on solder joint reliability 291—297 FCOB (flip chip on board), with imperfect underfills, fracture mechanics in finite element analysis 265—267 FCOB (flip chip on board), with imperfect underfills, near the fillet areas 267—277 FCOB (flip chip on board), with imperfect underfills, PCB thickness effect (near the corner solder joints 285—290 FCOB (flip chip on board), with imperfect underfills, possible failure modes 254—265 Fein Focus x-ray imaging system 556 Filled microvia technology 223 Fillet areas 267—277 Film redistribution layer (FRL) 223 Filmlike no-flow underfills 251—256 Finite element analysis 265—267 Finite element modeling for NuBGA package 474—477 481 496 Finite element modeling of Rambus module 413—414 Finite element modeling of the FC-PBGA assembly 539—540 Finite element modeling of WLCSP assemblies 323—324 Flip chip in package (FCIP) configuration 267 Flip chip on board see "FCOB" Flip chip technology see "Solder-bumped flip chips" FLLD 141 see Flow rate of FCOB with underfills 204—206 Fly-through solder jet printing method 58—61 65 FormFactor, 344—347 FormFactor, FCOB 345—346 Four-point bending tests 203 Fracture mechanics in finite element analysis 265—267 Fracture mechanics, popcorning of PBGA packages by, crack growth at the interface between solder mask and copper 447—451 Fracture mechanics, popcorning of PBGA packages by, crack growth in the middle of die attach 442—447 Fracture mechanics, popcorning of PBGA packages by, crack initiation due to thermal expansion mismatch 435—437 Fracture mechanics, popcorning of PBGA packages by, described 434—435 Fracture mechanics, popcorning of PBGA packages by, methods 438—440 Fracture mechanics, popcorning of PBGA packages by, results 440—442 Fracture mechanics, popcorning of PBGA packages by, thermal expansion mismatch and pressure 437—438 Fracture toughness 201—204 Fraunhofer-Institute Reliability and Microintegration 174 Fringe patterns 380—382 FRL (film redistribution layer) 223 Fujitsu Laminate with Laser via and Deposit (FLLD) 141 Garofalo-Arrhenius steady-state creep 324 375 Gas-microwave plasma (GMP) 135 Gauge element numbering 421 Gauge factor 419 Georgia Institute of Technology (GIT) 203 Global deformation of surface laminar layer 382—383 Global thermal expansion mismatch 490 GMP (gas-microwave plasma) 135 HDI (high density interconnect) 223 heat dissipation 482—485 494 499 Heat paths of solder-bumped FCOB 306—308 heat sinks 310—312 Heat spreader 488 490 High density interconnect (HDI) 223 High-speed circuits, design charts 146—153 High-temperature solder bumps 184—186 High-thermal-conductivity underfill 310 Hitachi Chemical Co., HITAVIA Type 1 and Type 3 142 HP network analyzer 396 Humidity storage test 180 Hyundai MicroElectronics Inc., microscopic moire interferometry 343 Hyundai MicroElectronics Inc., omega-CSP 339—341 Ibiden, double-sided four-layer buildup board 142 IBM at Yasu, Surface Laminar Circuit (SLC) 142 IBM Corporation, DCA technology 184 IBM Corporation, FC-PBGA package 529—537 IBM Corporation, SLC structure 380 IBM Corporation, Surface Laminar Circuit (SLC) 142 IBSS (interpenetrating polymer buildup structure system) 223 IC wafer for the 32-pin SRAM 364—365 ICS see "Integrated circuits" Impedance of trace 397 Inductance measurement 506—507 Ink-jet printing technology 55—58 Integrated circuits, development history 1—2 Integrated circuits, materials 174—175 Integrated circuits, trends 2—9 see Intel, OLGA package technology 511—519 Interfacial fracture toughness 203 204 205 Interpenetrating polymer buildup structure system (IBSS) 223 Interstitial via holes (IVHs) 142 Isothermal fatigue data 114—115 Joint Electronics Devices Engineering Council (JEDEC) package specifications 452—453 554 556 Junction-to-board thermal performance 545 JVC, microvia production 142 Kilby, Jack 1 Known good die (KGD) 13 Lamination 166 Laser drilling technology, microvia market 144—145 Laser via fabrication 123 Laser-drilled microvias 126—132 LCD (liquid crystal display) 9 Lead-free solders for flip chip applications 116—118 Lead-free solders, determining melting temperature with a DSC 100—103 Lead-free solders, determining TCE with TMA 103—105 Lead-free solders, isothermal fatigue of 114—115 Lead-free solders, measuring moisture absorption with TGA 109—110 Lead-free solders, measuring storage modulus with DMA 105—109 Lead-free solders, microhardness of 118 Lead-free solders, physical and mechanical properties 100 Lead-free solders, steady-state creep of 110—114 Lead-free solders, thermal fatigue of 115—116 Lead-free solders, wetting behavior 118 Lead-free solders, worldwide efforts on 95—99 Linear variable differential transducer (LVDT) 104 Liquid crystal display (LCD) 9 Liquid technologies 134 Liquid-to-liquid temperature cycling 59 Liquidlike underfills, assembly process 237—240 Liquidlike underfills, curing conditions of 227—232 Liquidlike underfills, material properties 232—236 Liquidlike underfills, no-flow materials 224—227 Liquidlike underfills, nonlinear finite element analysis 241—246 Liquidlike underfills, recommendations 246—256 Liquidlike underfills, reliability testing 240—241 Load displacement response of solder-bumped FCOB assembly 568 Local deformation 383—385 Low-Alpha Lead Symposium 89 LVDT (linear variable differential transducer) 104 Matsushita, ALIVH fabrication process 140 143 MBGA (metal ball grid array) 10 MDSP (micro dynamic solder pump) 61 Mechanical shear testing 206 Melting temperature 100—103 116 Metal ball grid array (MBGA) 10 Metal mask technology 46 Metal sputtering 342—343
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