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Dally W.J., Poulton J.W. — Digital Systems Engineering (part 2)
Dally W.J., Poulton J.W. — Digital Systems Engineering (part 2)



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Íàçâàíèå: Digital Systems Engineering (part 2)

Àâòîðû: Dally W.J., Poulton J.W.

Àííîòàöèÿ:

What makes some computers slow? What makes some digital systems operate reliably for years while others fail mysteriously every few hours? Why do some systems dissipate kilowatts while others operate off batteries? These questions of speed, reliability, and power are all determined by the system-level electrical design of a digital system. Digital Systems Engineering presents a comprehensive treatment of these topics. It combines a rigorous development of the fundamental principles in each area with down-to-earth examples of circuits and methods that work in practice. The book not only can serve as an undergraduate textbook, filling the gap between circuit design and logic design, but also can help practicing digital designers keep up with the speed and power of modern integrated circuits. The techniques described in this book, which were once used only in supercomputers, are now essential to the correct and efficient operation of any type of digital system.


ßçûê: en

Ðóáðèêà: Òåõíîëîãèÿ/

Ñòàòóñ ïðåäìåòíîãî óêàçàòåëÿ: Ãîòîâ óêàçàòåëü ñ íîìåðàìè ñòðàíèö

ed2k: ed2k stats

Ãîä èçäàíèÿ: 1998

Êîëè÷åñòâî ñòðàíèö: 238

Äîáàâëåíà â êàòàëîã: 16.03.2007

Îïåðàöèè: Ïîëîæèòü íà ïîëêó | Ñêîïèðîâàòü ññûëêó äëÿ ôîðóìà | Ñêîïèðîâàòü ID
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Ïðåäìåòíûé óêàçàòåëü
Dynamic Circuits, keepers      185 187
Dynamic Circuits, logic      186—190
Dynamic Circuits, refresh      185
Dynamic Latch      184—186
Edge connector      55—56
Elastomeric connectors      57—58
Electromagnetic field solvers      124—125 126
Electromagnetic interference (EMI)      288—289
Electrostatic discharge      548—558
Electrostatic discharge, failure mechanisms      550—552
Electrostatic discharge, failure mechanisms, oxide breakdown      550
Electrostatic discharge, failure mechanisms, thermal      551—552
Electrostatic discharge, human body model      549—550
Electrostatic discharge, protection      552—558
Electrostatic discharge, protection, dual diode      554—556
Electrostatic discharge, protection, field device      553—554
Electrostatic discharge, protection, guard rings      557—558
Electrostatic discharge, protection, latch up      554—556
Electrostatic discharge, protection, output driver      556—558
Electrostatic discharge, protection, power-supply shunt      554—555
Electrostatic discharge, protection, primary shunt      552—554
Electrostatic discharge, protection, punchthrough device      553—554
Electrostatic discharge, protection, secondary shunt      556
Electrostatic discharge, protection, series resistor      555—556
Electrostatic discharge, protection, thyristor shunt      555
Electrostatic discharge, protection, wiring      557—558
Energy-delay product      213—214
Error-correcting codes      349—350
Event encoding      400 411—415
Excitation equations      497—498
Exponential horn      181—182
Eye diagram      409—410 540—541
Fall time      401
False lock      631
Fiber optics      64—67
Finite-impulse-response (FIR) filter      364
Flexible circuit boards      53
Flexible printed-circuit board      42
Flicker noise      292
Flip-flop, charge sharing      588—589
Flip-flop, clock enable      580—581
Flip-flop, clock rise time      586—588
Flip-flop, differential      582
Flip-flop, double edge triggered      409 582—583
Flip-flop, dynamic charge leakage      584—585
Flip-flop, edge triggered      406—407 416 579—583
Flip-flop, failure mechanisms      583—589
Flip-flop, master-slave      408
Flip-flop, passgate      580
Flip-flop, race through      583—584
Flip-flop, RS-style      580
Flip-flop, supply noise immunity      585—586
Flip-flop, Svensson      581
Flip-flop, true single-phase      581
Flow table      492—493
Framing      377
Free-space optics      70—71
Frequency modulation      75
Frequency multiplier      613
Gain-bandwidth product      284
Gain-bandwidth product, CMOS Inverter      180—181
Gate capacitance      160—162
Gaussian noise      291 296—298
Gaussian noise, measurement      298
Gilbert cell      616
Guard rings      557—558
Gyrator      614—615
hazards      406
Heat equation      91
Hold time      185 407
Hysteresis      347—348
Impedance discontinuities, lumped model      90
Impedance, common-mode      109 110—111 201
Impedance, differential-mode      109 110—111 201
Impedance, lossless LC transmission line      92—93
Impedance, negative      202
Impedance, source      93—95
Impedance, transmission line      86—87
Impulse response      545—547
Incident wave      94
Incident-wave signalling      7
Inductance      84
Inductor, bond-wire      614—615
Input Race      493
Integrated-circuit, packages      30—39
Integrated-circuit, sockets      46
Integrated-circuit, sockets, zero-insertion-force      46
Integrated-circuit, wiring      29—30
Integrating amplifier      438—439 545
Inter-symbol interference      11 102—103 262 280—286
Inter-symbol interference, inertia] delay      282—285
Inter-symbol interference, reflections      281—282
Inter-symbol interference, resonant circuits      282
Interpolator      559—560 604—606
Interposer      46
Interposers      56—57
Isolation      111—112
Jitter      262 398—400 404 457
Jitter, definition      403
Johnson noise      291
Keepers      185
Keepers, use in dynamic gate      187
Laser diodes      63
Latch      408 418—423 574—579
Latch up      550 555
Latch, DCVSL      578—579
Latch, domino      188—189
Latch, dynamic      184—186
Latch, gate-isolated      185 575
Latch, single-phase      575—576
Latch, static      576—579
Latch, static noi, 'se margin      577
Latch, static, passgate      577
Latch, static, RS flip-flop      577—578
Latch, Svensson      186 575—576
Latch, writeability      578—579
launchers      138—139
LC Oscillator      613—615
Leaded chip carrier      33
Level shifters      603—604
light-emitting diodes (LEDs)      63
Linear regulators      231—233
Logic signalling      331 382—383
Logic, combinational      405—406
Logic, hazards      405
Logic, synchronous      406—407
Logical effort      175—176
Lone pulse problem      363—364
Loop filter      620—635
Loop filter, bang-bang control      633
Loop filter, charge pump      624—627
Loop filter, charge pump, voltage ripple      626—627
Loop filter, delay-locked loop      629—635
Loop filter, delay-locked loop, self-biased      630
Loop filter, digital control      633—635
Loop filter, digital control, deadband      634—635
Loop filter, RC      620—623
Loop filter, self-biased      627—629
Loop filter, switch-capacitor      630—631
Loop filter, turbo mode      632—633
Loss tangent      105
Lumped LRC wires      537
Make-before-break action      562
Manchester carry chain      169
Matched filter      546—547
Matched-delay circuits      499—502
Matching      601—602
Matching networks      144
Measurement      117—124 126—142
Measurement, crosstalk      131—134
Measurement, discontinuities      134—139
Measurement, examples      126—142
Measurement, frequency-dependent attenuation      127—130
Measurement, network analyzer      122—124 128—129
Measurement, package parasitics      138—142
Measurement, practice      142
Measurement, time-domain reflectometer      117—121 128—129 131—139
Measurement, time-domain transmission      121 128
Mesochronous      402 463 473—474
Mesochronous, synchronizer      475—480
Metal migration      243
Metastability      468—472
Metastable state      469 577
Mezzanine card      48
Microstripline      83—84
Miller effect      89 179—180
Mixer      616
Mode coupling      109—110 202—203
Modulation      74—76
Modulation, amplitude modulation (AM)      74
Modulation, bi-phase      62
Modulation, code-division multiple access (CDMA)      75—76
Modulation, frequency modulation (FM)      74—75
Modulation, nn-off keying      62
Modulation, Optical      63
Modulation, phase modulation (PM)      74
Modulation, quadrature amplitude modulation (QAM)      75
Moore's law      12—14
MOSFET      149—159
MOSFET, body effect      155—156
MOSFET, channel-length modulation      154—155
MOSFET, CMOS gate      170—183
MOSFET, Complementary (CMOS)      154
MOSFET, depletion mode      158
MOSFET, device structure      150—151
MOSFET, dynamic circuits      184—191
MOSFET, enhancement mode      158
MOSFET, gate capacitance      160—161
MOSFET, I-V characteristics      151—158
MOSFET, junction capacitance      162
MOSFET, p-channel      152—153
MOSFET, parameter variation      158—159 288—290
MOSFET, parasitic circuit elements      159—163
MOSFET, parasitic resistance      162—163
MOSFET, pass gate      166
MOSFET, resistive region      152
MOSFET, resistors      203—204 516—519
MOSFET, saturation region      156—157
MOSFET, secondary breakdown      551 553—554 556
MOSFET, SPICE models      163—164
MOSFET, subthreshold current      157
MOSFET, switch networks      166—169
MOSFET, threshold voltage      151
MOSFET, transient response      173—175
MOSFET, transition region      152
MOSFET, typical parameters      158
MOSFET, velocity saturation      156
Mother board      48—49
Muller C-element      501
Multi-chip modules      36
Multi-level signalling      344—347
Multipath      76—77
Multiplexing transmitter, input multiplexing      538—539 563
Multiplexing transmitter, output multiplexing      537—539
N of M signalling      379—380
NAND gate, transient response      175—176
Network analyzer      122—124 128—129
Network analyzer, test set      122
NFET      149—150
Noise      10—12
Noise budget      11—12
Noise cancelling      12
Noise effective temperture      72—73
Noise margin, II      12 170—171 347 349
Noise, alpha particles      285—288
Noise, alpha particles, critical charge      287
Noise, bit-error rate      297
Noise, budgets      292—296
Noise, crosstalk      262 267—280
Noise, crosstalk, 1/f noise      292
Noise, crosstalk, capacitive      268—271
Noise, crosstalk, power supply      280
Noise, crosstalk, signal return      278—280
Noise, crosstalk, transmission line      272—273 see
Noise, electromagnetic interference      288—289
Noise, flicker noise      292
Noise, Gaussian      296—298
Noise, Gaussian, measurement      298
Noise, immunity      308—309
Noise, immunity, inertial delay      282—283
Noise, immunity, inter-symbol interference      262 280—285
Noise, immunity, reflections      281—282
Noise, Johnson noise      291
Noise, margin      308—311 347 349
Noise, models      566—567
Noise, offsets      262
Noise, power supply      262 263—267 282 322—325 343—344 600—602
Noise, power supply, differential      266—267
Noise, power supply, single supply      264—266
Noise, power supply, typical values      264—265
Noise, process variation      288—291
Noise, proportional      260—261
Noise, resonant circuits      282
Noise, shot noise      291—292
Noise, signal induced      260—261
noise, signal-to-noise ratio      296—297
Noise, sources      261—263
Noise, statistical analysis      292 297
Noise, thermal noise      291
Noise, timing      262
Noise, worst-case analysis      292
Non-re turn-to-zero signalling      412
NOR gate, transient response      175—176
Offset voltage      318
On-off-keying      63
Open drain      526—528
Open-loop timing      396—397
optical amplifiers      70
Optical communication      62—71
Optical communication, fiber      64—67
Optical communication, free-space      70—71
Optical communication, modulation      63
Optical communication, multiplexing      65—69
Optical communication, receivers      67—68
Optical communication, time-division multiplexing      69—70
Optical communication, transmitters      63—64
Optical communication, wavelength-division multiplexing      68—69
Optical connectors      66—67
optical fiber      64—67
Optical fiber, multi-mode      65—66
Optical fiber, single-mode      65—66
Optical isolation      112—113
Optocouplers      113
Oscillator, crystal      610—613
Oscillator, LC      613—615
Oscillator, voltage-controlled      442—443 608—615 see
Output impedance      317
Oversampling receiver      447—449
Package, ball-grid array      34—35
Package, dual-inline      32
Package, electrical model      37—39
Package, leaded-chip carrier      32—33
Package, pin-grid array      32—33
Package, quad flat pack      33
Package, surface-mount      32—35 44—46
Package, through-hole      32—33
Packages, model      563—564
packaging      26—77
Packaging, area bonding      242—243
Packaging, integrated-circuit      30—39
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