This work describes the influence of film thickness (0.2 to 3.1 µm) and Al content (45 to 52 at-% Al) on the yield strength, the fracture toughness and the creep strength of polycrystalline NiAl films. The NiAl films were sputter-deposited on Si substrates and were thermally cycled up to 700 °C. The stress evolution during thermal cycling was measured using a laser-optical substrate-curvature technique.