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Название: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Авторы: Puttlitz K.J. (ed.), Stalter K.A. (ed.)
Аннотация:
This book serves as a handbook/primer for those converting from standard Sn-Pb solder microelectronic assemblies to Pb-free systems. It covers key aspects associated with this issue, including health, total environmental impact, legislation, market economics, and related materials, process, and reliability challenges. After chapters on key issues associated with the lead-free movement, a second section details various materials utilized and looks at manufacturing practices associated with the fabrication of microelectronic assemblies. A third section examines reliability issues of concern in solders used in electronic assemblies. Some knowledge of science or engineering principles is assumed. Since the book contains material that relates to a range of electronics products, from low-to high-end applications, the audience for the book includes all those involved in bringing microelectronics products to the marketplace. Puttlitz and Stalter are both affiliated with IBM Corporation.