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Tummala R.R. — Fundamentals of Microsystems Packaging
Tummala R.R. — Fundamentals of Microsystems Packaging



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Название: Fundamentals of Microsystems Packaging

Автор: Tummala R.R.

Аннотация:

The only book to teach microsystems packaging—written by the field's leading authorThis is the book that engineers, technicians, and students want—the first to teach microsystems packaging from the ground up. Rao Tummala's one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It's the only book to do so. This much-needed tool features:


*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.
*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
*Hundreds of explanatory two-color illustrations
*Self-test problems and solutions in every chapter
*Glossary
*The best way to learn microsystems packaging through self-study or in a classroom—and the most comprehensive on-the-job reference


Язык: en

Рубрика: Технология/

Статус предметного указателя: Неизвестно

ed2k: ed2k stats

Издание: 1st edition

Год издания: 2004

Количество страниц: 923

Добавлена в каталог: 15.08.2009

Операции: Положить на полку | Скопировать ссылку для форума | Скопировать ID
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