Poprawe R. (ed.), Loosen P., Bachmann F. — High Power Diode Lasers: Technology and Applications :: Электронная библиотека попечительского совета мехмата МГУ

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Poprawe R. (ed.), Loosen P., Bachmann F. — High Power Diode Lasers: Technology and Applications

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Название: High Power Diode Lasers: Technology and Applications

Авторы: Poprawe R. (ed.), Loosen P., Bachmann F.

Аннотация:

The book summarizes the work and the results of a five year government funded research project as well as subsequent research results about high power diode laser systems and their application in the field of materials processing. The entire technology chain, starting from the semiconductor technology, over cooling mounting and assembly, beam shaping and system technology down to the applications in processing of several kinds of materials (metals, polymers) are treated in the book. Theoretical models, a wide field of important parameters and practical hints and tips are provided. The book is the most extensive work on high power diode laser systems and materials processing applications.

Язык:

Рубрика: Физика/

Статус предметного указателя: Готов указатель с номерами страниц

ed2k: ed2k stats

Год издания: 2007

Количество страниц: 554

Добавлена в каталог: 26.02.2008

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Предметный указатель

Flux      358
Focal diameter      335 353 389 392 409
Focal length      37 131 136 149 163 305 306 328 331 393 407
Focal position      310 316 317 393
Focal spot position      420
Focusability      388
Focusing      400
Focusing optics      392 408
Force/elongation diagram      360
Forming tools      479 503 509 510
Free-form surfaces      415
Fresnel absorption      391
Frictional heat      421
Full penetration      315 316 317
Fume      291
Fusing time      403
Fusion cutting      389
Galvanization      328 329
Galvanized steel      333
Galvanometer scanner      353
Galvanometric scanning mirrors      367
Gap      326 345 377
Gap bridging      316 320 322—323 331 372 377 378
Gap bridging capabilities      383 385
Gap width      323
Gas foot point      311 312
Gas jet      407 408
Gas nozzle      311
Gas pressure      391 407
Gaussian beam      181 187 193
Gaussian beam, profile      273
General astigmatic      190
Glass      399
Glass fiber concentration      379
Grade of crystallisation      379
Graphical User Interface      272 278
graphite      389
Guiding rails      459
Handling system      391 399
Hardening      425
Hardness      313
Hardness gradient      423
Hardness profile      313 314
Hartmann sensor      205
heat capacity      390
Heat conduction      87 304 394 406
Heat conduction, equation      338
Heat conduction, losses      390 395
Heat conduction, welding      286 288 321 324 333 334 338 339
Heat conductivity      338 390
Heat conductivity of polymers      376
Heat load      389
Heat radiation      371 374
Heat sink      19—24 61—69 79—82 87—91 94—105 150
Heat source      338 341 406 412 413
Heat spreading      88 106
Heat transfer coefficient      88 89 90 92
Heat-affected zone      313 314
Heating      390 403 413 419
Height profile      300
Helium      310 312 322
Hem flange      342 343
High carbon steel      335
High-brightness      55
High-brightness, arrays      69—70
High-brightness, emitters      55
High-brightness, systems      233—245
High-power laser diode      See Diode lasers
High-strength steel      313 315
High-temperature-resistant steel      412
Holmium-YAG laser      370
Holographic interferometry      107
Homogeneity      34
Homogeneity, Beam quality      236 265 269 275 374 410
Homogeneity, intensity      162 164 235 262
Homogeneity, powder stream      487
Homogeneity, wavelength      41 50
Homogeneity, waver growth      26 27
Homogenization      138—141 164 266
Homogenizer      262
Hot forming tool steels      419
Hot machining      413
Hot-melt adhesive      381—382
Hot-zinc-dipped mild steel      398
Hybrid      487
Hybrid circuits      357
Hybrid process      405
Hybrid process, LAAPS      512
IEC 60825—1      209
Ignition temperature      391 406 408
III/V compound semiconductors      7
Image processing      352 374
Image processing with IR-camera      373
Incidence angle      345
Inclination angle      345
Incoherent beam superposition basics      125—128
Incoherent beam superposition collimation      128—141
Incoherent beam superposition combination techniques      142—149
Incoherent beam superposition quality      121—125 175—177
Incoherent beam superposition stacking techniques      150—162
Incoherent beam superposition symmetrization and fiber coupling      162—174
Indium      80 103
Indium solder      112
Induction      473
Induction, hardening      433 472 480
Industrial applications      387 400
Inert gas cutting      389 393—394
Inert gas jet      389
Inert gas nozzle      345
Influence of geometry      380
Injection      483
Injection valve      334 467
Integrating sphere      34
Intensities      389
Intensity distribution      374 379
Interaction zone      390
Internal loss      17
International Standards      121 122 181—183 203 204 210—211
Intrinsic general astigmatic      191
Intrinsic optical parameters      22
Ion beam sputtering (IBS)      144
Ion-assisted-deposition (IAD)      144
IR-camera      352 374
Iron      406 432 501
Iron combustion      406 407
Iron oxide      406
Irradiation time      321 360
ISO 11146      64 67 130 211 212
ISO 17526      206
ISO 306      380
Joining of plastic to metal      381
Joining technologies      285 286
Joint gap      344
Joint geometries      363
Joint interface      318
Joint tracking      300
Joints      323
Kerf cross section      390
Kerf volume      390 394 406
Kerf width      389 390 406
Keyhole      289
Kramers — Kronig relation      15
Lap joint      324 330 326 336
Large optical cavity (LOC)      14 48
Large-scale production      27
Laser beam oxygen cutting      405 406 411
Laser beam soldering      349 359 360
Laser beam welding, of thermoplastics      361 362 386 387
Laser brazing      342
Laser cutting      389 392

Laser cutting systems      388
Laser fusion cutting      390
Laser hardening      272 426 427
Laser light pattern      290
Laser operation, principle of      5—25
Laser power      306 391 395 396 397 408 409 421 422
Laser power at workpiece      394
Laser processing      27—31
Laser protective window      418
Laser punching      401 405
Laser reflection polarimetry      109 115
Laser soldering system      353
Laser spot position      320
Laser triangulation      298
Laser vaporization cutting      390
Laser wavelength      391
Laser welding      286
Laser-assisted atmospheric plasma spraying (LAAPS)      488 512
Laser-assisted machining      278 283 388 413 416 419 421 423 425
Laser-assisted machining of metallic materials      423
Laser-assisted milling      413 414 416 420 421 425
Laser-assisted milling of steel      424
Laser-assisted milling of Stellites      425
Laser-assisted roughing      423
Laser-assisted turning      413 423
Laser-spot orientation      316
Latent heat      389 390
Lateral waveguide      15—16
Laval nozzle      272 407 409
Leading nozzle      311
Leather      396 397 398
Length of cut      422
Lifetime      53—55 63 86 98—101 206—209
Light pipe      139
Line current density      21
Line series resistance      22
Line-shaped laser beam      350 400
Linear guiding rails      436 459—467
Linear optical systems      185—186
linear polarization      396
Linewidth enhancement factor      57 58
Long-term stability      204
Longitudinal mode      16
losses      48
Machine tool      414
Machine tool, design      416
Machining      388 413
Machining properties      413
Machining strategies      423
Machining time      424 425
Machining zone      414
Manufacturing technology, of semiconductor laser      25—33
Marangoni effect      313
Martensite      313 314 474 501
Martensitic structure      432
Mask welding      366—367
mass density      390
material      388
Material, gain      11
Material, parameter      49
Material, removal      389
Material, removal rate      412 421 424
Material, strength      388 413
Material, thickness      390
Maximum cutting speed      393 394 395 396 397 408 410
Maximum Permissible Exposure      209
Maximum welding depth      287
Maxwell equations      183
Mean-time-to-failure (MTTF)      86
Mechanical processes      405
Medium-term stability      204
Melt      324 389
Melt burr      381
Melt ejection      393 394
Melt flow      394
Melt front      403
Melt pool      286 287 288—289
Melting      376 388 390 394 402
Melting point      324 338
Melting point of solder for heat sink      77 95 102
Melting temperature      380 390 403
Melting volume      403
Metal cutting      388
Metallization      31
Metrology      181—212
Micro-lenses      131
Micro-optic mounting      155—158
Micro-optics      117—118
Micro-welding      336—338
Microchannel cooler      150
Microchannel heat sinks      94—101
Microstructure      313 314 434 484 499 517
Microtome cuts      363 377 383 384 386
Mild steel      288 304 305 306 314 320 328 339 388 393 394 396 397 398 405 406 408 409 410 411
Milling machine      414
Milling path      422
Milling tool      415 419 420 422
Mirror coating      31—32
Mobile cladding system      509
Modal optical gain      10
Modular hardening system      272 448
Modular setup      245
Moire fringe analysis      107
MOPAs (master-oscillator power amplifiers)      56
Morphous polymers      379
Mounting process      77 102
Moving knife-edge      197
Moving pinhole      198—200
Moving slit      197
Multi-reflection      289
Mutual coherence      183—184
Nd:YAG laser      326 330 332—333 334—335 370 388 399
Near-field profile      59 65
Near-net-shape      423
Nickel-based alloys      413
Nitrogen      389 394 395 396 397
Nitrogen cuts      398
Nitrogen-assisted cutting      395 398
Nominal ocular hazard distance (NOHD)      209
Non-contact sensors      298
Non-metals      391 397 399
Notch effect      527
Nozzle      328 391 393—394 407 408
Nozzle angle      310
Nozzle parameters      311
Nozzle stand-off distance      393 408
Nozzle’s orientation      310
Numerical aperture      128
Offline programming      330
Offset      322—323
On-line process control      374
Operation temperature      35 36
Optical characteristics      49—53
Optical gain      7—11
Optical losses      58
Optical penetration depth      363 364 375 376 383 385
Optical power      34
Optical power density      20
Optical properties      375 376
Optical resonator      11—12
Optical stacking      149
Optical-path rotating devices      168
Optimization, of wall plug efficiency      23
Organic coating      346
Organic materials      396
Out-gassing gap      327
Output power      391
Overheating      377
Overlap joint      346 363 364 383
Overlap welding      335 378 381

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