Hybrid Microcircuit Technology Handbook was the first comprehensive
book on hybrid microelectronics. Published in 1988, it has become
the industry standard and has also been used in many university short courses.
Since publication of the first edition, many significant advances have
occurred in IC chips that have driven the hybrid packaging processes toward
even higher densities and greater performance. The almost exponential
increase in density, complexity, and performance of integrated circuits over
the past ten years-for example ASIC (Application Specific Integrated
Circuit), VHSIC (Very High Speed IC), VLSIC (Very Large Scale IC), and
ULSIC (Ultra Large Scale IC)-have driven developments in the interconnect
substrates culminating in what is now know as multichip modules
(MCM). However, the fundamentals of design, fabrication, and testing of
MCMs are essentially the same as for hybrid microcircuits. In the authors’
opinion, MCMs are extensions of hybrid circuits that can accommodate the
new generation of high-speed high-performance chips.