Content:
Foreword, Pages ix-x, Gordon E. Moore
Preface to the Second Edition, Pages xi-xii, Krishna Seshan
Preface to the First Edition, Pages xiii-xiv, Klaus K. Schuegraf
Contributors, Pages xv-xvi
Recent Changes in the Semiconductor Industry, Pages 1-9, Krishna Seshan
1 - Deposition Technologies and Applications: Introduction and Overview, Pages 11-43, Werner Kern, Klaus K. Schuegraf
2 - Silicon Epitaxy by Chemical Vapor Deposition, Pages 45-110, Martin L. Hammond
3 - Chemical Vapor Deposition of Silicon Dioxide Films, Pages 111-150, John Foggiato
4 - Metal Organic Chemical Vapor Deposition: Technology and Equipment, Pages 151-203, John L. Zilko
5 - Feature Scale Modeling, Pages 205-240, Vivek Singh
6 - The Role Of Metrology And Inspection In Semiconductor Processing, Pages 241-286, Mark Keefer, Rebecca Pinto, Cheri Dennison, James Turlo
7 - Contamination Control, Defect Detection, and Yield Enhancement in Gigabit Manufacturing, Pages 287-318, Suresh Bhat, Krishna Seshan
8 - Sputtering and Sputter Deposition, Pages 319-348, Stephen Rossnagel
9 - Laser and Electron Beam Assisted Processing, Pages 349-379, Cameron A. Moore, Zeng-qi Yu, Lance R. Thompson, George J. Collins
10 - Molecular Beam Epitaxy: Equipment and Practice, Pages 381-461, Walter S. Knodle, Robert Chow
11 - Ion Beam Deposition, Pages 463-499, John R. McNeil, James J. McNally, Paul D. Reader
12 - Chemical Mechanical Polishing, Pages 501-512, Kenneth C. Cadien
13 - Organic Dielectrics in Multilevel Metallization of Integrated Circuits, Pages 513-593, Krishna Seshan, Dominic J. Schepis, Laura B. Rothman
14 - Performance, Processing, and Lithography Trends, Pages 595-607, Krishna Seshan
Index, Pages 609-629