Content: An analysis of process issues with chemically amplified positive resists / O. Nalamasu, A.G. Timko, Elsa Reichmanis, F.M. Houlihan, Anthony E. Novembre, R. Tarascon, N. Mu?nzel, and S.G. Slater —
The annealing concept for environmental stabilization of chemical amplification resists / Hiroshi Ito, Greg Breyta, Donald C. Hofer, and R. Sooriyakumaran —
Structure-property relationship of acetal-and ketal-blocked polyvinyl phenols as polymeric binder in two-component positive deep-UV photoresists / C. Mertesdorf, N. Mu?nzel, P. Falcigno, H.J. Kirner, B. Nathal, H.T. Schacht, R. Schulz, S.G. Slater, and A. Zettler —
Lithographic effects of acid diffusion in chemically amplified resists / C.A. Mack —
Acid diffusion in chemically amplified resists : the effect of prebaking and post-exposure baking temperature / Jiro Nakamura, Hiroshi Ban, and Akinobu Tanaka —
Correlation of the strength of photogenerated acid with the post-exposure delay effect in positive-tone chemically amplified deep-UV resists / F.M. Houlihan, E. Chin, O. Nalamasu, J.M. Kometani, and R. Harley —
Following the acid : effect of acid surface depletion on phenolic polymers / James W. Thackeray, Mark D. Denison, Theodore H. Fedynyshyn, Doris Kang, and Roger Sinta —
Water-soluble onium salts: new class of acid generators for chemical amplification positive resists / Toshio Sakamizu, Hiroshi Shiraishi, and Takumi Ueno —
Photoacid and photobase generators: arylmethyl sulfones and benzhydrylammonium salts / J.E. Hanson, K.H. Jensen, N. Gargiulo, D. Motta, D.A. Pingor, Anthony E. Novembre, David A. Mixon, J.M. Kometani, and C. Knurek —
Functional imaging with chemically amplified resists / Alexander M. Vekselman, Chunhao Zhang, and Graham D. Darling —
Hydrogen bonding in sulfone- and N-methylmaleimide-containing resist polymers with hydroxystyrene and acetoxystyrene : two-dimensional NMR studies / Sharon A. Heffner, Mary E. Galvin, Elsa Reichmanis, Linda Gerena, and Peter A. Mirau —
NMR investigation of miscibility in novolac-poly(2-methyl-1-pentene sulfone) resists / Sharon A. Heffner, David A. Mixon, Anthony E. Novembre, and Peter A. Mirau —
Styrylmethylsulfonamides : versatile base-solubilizing components of photoresist resins / Thomas X. Neenan, E.A. Chandross, J.M. Kometani, and O. Nalamasu —
4-Methanesulfonyloxystyrene : a means of improving the properties of tert-butoxycarbonyloxystyrene-based polymers for chemically amplified deep-UV resists / J.M. Kometani, F.M. Houlihan, Sharon A. Heffner, E. Chin, and O. Nalamasu —
Dienone-phenol rearrangement reaction : design pathway for chemically amplified photoresists / Ying Jiang, John Maher, and David Bassett —
Single-layer resist for ArF excimer laser exposure containing aromatic compounds / Tohru Ushirogouchi, Takuya Naito, Koji Asakawa, Naomi Shida, Makoto Nakase, and Tsukasa Tada —
Design considerations for 193-nm positive resists / Robert D. Allen, I-Y. Wan, Gregory M. Wallraff, Richard A. DiPietro, Donald C. Hofer, and Roderick R. Kunz —
Top-surface imaged resists for 193-nm lithography / Roderick R. Kunz, Susan C. Palmateer, Mark W. Horn, Anthony R. Forte, and Mordechai Rothschild —
Silicon-containing block copolymer resist materials / Allen H. Gabor and Christopher K. Ober —
A top-surface imaging approach based on the light-induced formation of dry-etch barriers / U. Schaedeli, M. Hofmann, E. Tinguely, and N. Mu?nzel —
Plasma-developable photoresist system based on polysiloxane formation at the irradiated surface : a liquid-phase deposition method / Masamitsu Shirai, Norihiko Nogi, Masahiro Tsunooka, and Takahiro Matsuo —
New polysiloxanes for chemically amplified resist applications / J.C. van de Grampel, R. Puyenbroek, A. Meetsma, B.A.C. Rousseeuw, and E.W.J.M. van der Drift —
Environmentally friendly polysilane photoresists / James V. Beach, Douglas A. Loy, Yu-Ling Hsiao, and Robert M. Waymouth —
Fluoropolymers with low dielectric constants : triallyl ether-hydrosiloxane resins / Henry S.-W. Hu, James R. Griffith, Leonard J. Buckley, and Arthur W. Snow —
Photophysics, photochemistry, and intramolecular charge transfer of polyimides / Masatoshi Hasegawa, Yoichi Shindo, and Tokuko Sugimura —
Structure, properties, and intermolecular charge transfer of polyimides / Masatoshi Hasegawa, Junichi Ishii, Takahumi Matano, Yoichi Shindo, Tokuko Sugimura, Takao Miwa, Mina Ishida, Yoshiaki Okabe, and Akio Takahashi —
Application of polyisoimide as a polyimide precursor to polymer adhesives and photosensitive polymers / Amane Mochizuki and Mitsuru Ueda —
Polyimide nanofoams prepared from styrenic block copolymers / J.L. Hedrick, T.P. Russell, C. Hawker, M. Sanchez, K. Carter, Richard A. DiPietro, and R. Jerome —
Internal acetylene unit as a cross-link site for polyimides / Tsutomu Takeichi and Masaaki Tanikawa —
Vapor-depositable polymers with low dielectric constants / J.A. Moore, Chi-I Lang, T.-M. Lu, and G.-R. Yang —
Plasma polymerization in direct current glow: characterization of plasma-polymerized films of benzene and fluorinated derivatives / Toshihiro Suwa, Mitsutoshi Jikei, Masa-aki Kakimoto, and Yoshio Imai —
Syntheses and properties of allylated poly(2,6-dimethyl-1,4-phenylene ether) / Yoshiyuki Ishii, Hiroji Oda, Takeshi Arai, and Teruo Katayose —
Synthesis and photochemistry of a 2,6-dialkoxyanthracene-containing, side-chain-substituted liquid-crystalline polymer / David Creed, Charles E. Hoyle, Anselm C. Griffin, Ying Liu, and Surapol Pankasem —
Hybrid polyimide-polyphenylenes by the Diels-Alder polymerization between biscyclopentadienones and ethynyl-terminated imides / Uday Kumar and Thomas X. Neenan —
Polysiloxane thermoplastic polyurethane modified epoxy resins for electronic application / Tsung-Han Ho and Chun-Shan Wang.