"MEMS/MOEMS Packaging" is an unusual, perhaps even a deceptive book. It might be mistaken for only a broad technology survey, covering in detail the present state of MEMS packaging. Under that guise, Dr. Ken Gilleo provides a well-structured explanatory tour, beginning with the engineering fundamentals of microelectronic packaging, and progressing through MEMS materials, fabrication, packaging, and challenges, to the new tools of nanotechnology. More than two hundred citations provide further details.

However, Dr. Gilleo is not a tourist in the packaging world; he is an active explorer. He uses this survey of proven packaging technology as a springboard to the unproven. His focus often shifts from the present to the future, from what has been done to what yet needs to be done, and how it might best be approached. "Should" and "could" are the vocabulary of an explorer, not of a surveyor.

His creative suggestions are based on a single proven premise: we cannot develop optimal packaging for MEMS and MOEMS by simply following the packaging paths that worked well for silicon chips with no moving parts. New approaches are needed.

"Finding better packaging solutions" is the real subject of this excellent book.