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Название: Lead Free Solder: Mechanics and Reliability
Автор: Pang J.H.L.
Аннотация:
This book on “Lead Free Solder: Mechanics and Reliability” provides a comprehensive knowledge base for Pb-free solder mechanical properties, materials constitutive models, fatigue life prediction models, finite element modeling, and simulation of reliability test results. Application of Pb-free solders requires advance mechanics of materials characterizations, computational modeling and simulation of reliability tests subject to thermal cycling test, vibration fatigue test, and board-level drop impact test conditions.