This book presents a state-of-the-art and in-depth overview of power electronic packaging design, assembly processes, material characterization, reliability, and modeling. Recent advances in power electronic packaging are presented based on the development of power device integration. The book also covers how advances in both semiconductor content and advanced power package design and materials have co-enabled significant advances in power device capability during recent years. Extrapolating the same trends in representative areas for the remainder of the decade serves to highlight where further improvement in materials and techniques can drive continued enhancements in thermal management, usability, efficiency, reliability, and overall cost of power semiconductor solutions.