This book provides information on the state-of-the-art technologies and methodologies related to moisture issues in plastic packages. The book covers the wide aspects including moisture diffusion and desorption, characterization and modeling, hygroscopic swelling, interfacial adhesion degradation, accelerated moisture sensitivity/reflow test, electrical-chemical migration, moisture-aging effect on longterm reliability, and several finely selected real-world case studies on various failure mechanisms due to moisture. This is the first book ever to cover the full spectrum of moisture-induced failure mechanisms in IC packages. It is a timely and important contribution to the technical literature for researchers, engineers, and practitioners both in academia and in electronics industry.