This book presents a methodology by which solder joint fatigue life prediction in multiple environments can be done in a timely, accurate, and easy-to-use manner. Analytical methods, numerical methods, and experimental data are used to investigate and develop solder joint reliability predictions for thermal cycling, power cycling, and vibration environments. This book does not delve deeply into some new aspect of solder joint reliability; rather it uses well known modeling methods and tools in new ways to investigate issues relevant to solder joint reliability in multiple environments.
The book is geared towards a broad audience, from graduate students to current industry reliability experts. In fact, the two authors of the book reflect this range well as Dr. Perkins has recently graduated with his PhD specializing in solder joint reliability, while Dr. Sitaraman has an extensive research and publication history in microelectronic packaging reliability.